Projects

Technical Capabilities

Number of layers

Mass production:2-24 layers/Sample:30 layers

Plate thickness

Mass production:0.6-3.2mm/Sample:10mm

Material type

FR-4(Regular FR4,Medium Tg,High Tg)、CEM-3、Aluminum Base

Minimum line width/line spacing

Inner layer

0.5 OZ Base copper：3/3mil

1.0 OZ  Base copper：4/4mil（Partial line3/3mil）

2.0 OZ Base copper：6/6mil

Outerlayer

ENIG PCB

0.5 OZ Base copper：4/4mil（Partial line3/3mil）

1.0 OZ  Base copper：5/5mil（Partial line4/4mil）

2.0 OZ Base copper：8/8mil

HASL PCB

0.5 OZ Base copper：4/4mil（Partial line3/3mil）

1.0 OZ  Base copper：5/5mil（Partial line4/4mil）

2.0 OZ Base copper：8/8mil

Max copper thickness

Production:3OZ(UL)/Sample: 12OZ(Sample)

Vinimum aperture

Mechanical drilling 8mil (0.20mm), Finished 4mil (0.10mm)

Max size (Finished product)

650*1300mm

Max finished product thickness to diameter ratio

15:1

Surface Finishing

HASL、Lead-free-HASL、ENIG、OSP、Gold-finger

Impedance tolerance

±10%