Projects

Technical Capabilities

Number of layers

Mass production:2-24 layers/Sample:30 layers

Plate thickness

Mass production:0.6-3.2mm/Sample:10mm

Material type

FR-4(Regular FR4,Medium Tg,High Tg)、CEM-3、Aluminum Base

Minimum line width/
line spacing

Inner layer

0.5 OZ Base copper： 3/3mil

1.0 OZ Base copper：4/4mil（Partial line3/3mil）

2.0 OZ Base copper：6/6mil

Outerlayer

ENIG PCB

0.5 OZ Base copper：4/4mil（Partial line3/3mil）

1.0 OZ Base copper：5/5mil（Partial line4/4mil）

2.0 OZ Base copper：8/8mil

HASL PCB

0.5 OZ Base copper：4/4mil（Partial line3/3mil）

1.0 Oz Base copper：5/5mil（Partial line4/4mil）

2.0 O Base copper：8/8mil

Maximum copper thickness

Production:3oz(UL)/Sample: 12oz(Sample)

Vinimum aperture

Mechanical drilling 8mil (0.20mm), Finished 4mil (0.10mm)

Maximum size (Finished product)

Maximum 650*1300mm

Maxmum finished product thickness to diameter ratio

15:1

Surface Finishing

HASL、Lead-free-HASL、ENIG、OSP、Gold-finger

Impedance tolerance

10%

Time  for  delivery

Sample

Patch

Single-sided/double-sided

2days

7days

Multi-layer

Through  -hole

Within
6  layers

3days

10days

6-12layers

4days

12days

HDI

1+N=1

4days

12days

2+N+2

7days

15days

Special  PCB

4days

10days

Rigid-flex  PCB

7days

15days